Principles of Cryogenic Adhesive Bonding

Instructions:
- Add this to your calendar for a convenient 15-minute reminder.
- Enjoy!

Abstract:
This presentation is a high-level overview of adhesives used in cryogenic applications. This includes discussions of properties to consider when selecting an adhesive, the different types of adhesives available, and general advice on surface preparation and bonding of adhesives.

About the Speaker:
This presentation was authored by Jim Denman, an experienced Materials and Processes (M&P) Engineer with over 40 years of experience in Space Applications. Jim spent the first thirty years of his career at Hughes Space and Communications, which then became Boeing Satellite Systems, in a variety of engineering and management roles. More recently, he’s been a senior M&P engineer at JPL, as a subject matter expert in adhesives across all projects. He has supported a range of missions, including NEO Surveyor, that operates at cryogenic temperatures.

This presentation is given by Qian (Nataly) Chen, Ph.D., an M&P engineer at JPL, who has been working with Jim on NEO Surveyor and on adhesives in general for the past ten years.